In modern SMT production, BGA, QFN, and LGA components hide thousands of solder joints beneath the package. Traditional AOI and visual inspection can’t see them — but a single void, bridge, or head-in-pillow defect can kill reliability and cause expensive field failures.

This is exactly why X-ray PCB solder joint inspection has become essential on high-quality lines.

With closed-tube X-ray systems (100–160 kV), you can instantly see:

  • Voids and void percentage
  • Solder bridges under components
  • Head-in-pillow and non-wetting issues
  • Insufficient/excessive solder volume
  • Cracks and component misalignment

A quick 2D scan takes only seconds, while 3D CT gives precise volumetric measurement when needed.

Real factory data shows: using systematic X-ray inspection reduces hidden defect escapes by over 80% and dramatically cuts rework and warranty costs.

Want to see real X-ray images of typical BGA voids, bridges, and HiP defects? → Full details and high-resolution examples here: X-ray PCB Solder Joint Inspection – Complete Guide →

Ready to upgrade your quality control? Drop us a mail: smt@smt11.com